Sanwa Holdings Corp

Sanwa Holdings CorpJapan

€19.30
Dividend Yield (FWD)
4.20%
Annual Payout (FWD)
JP¥146.00
Dividend Growth Rate (CAGR)
#.##%
Ex-DatePay DateAmountChange
JP¥141
16.53%
JP¥73
7.35%
JP¥68
9.68%
JP¥121
26.04%
JP¥62
5.08%
JP¥59
25.53%
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Sanwa Holdings Corp pays a dividend yield (FWD) of 4.20%.

ISIN
WKN
Symbol / Exchange
/ XTKS
Value
€19.30
Dividend frequency
biannually
Security Type
Equity
Sector

Industrials

Industry

Building Products

Country
Japan

Japan

Dividend Currency
Japanese Yen
Earnings Date
Resources

ETFs holding Sanwa Holdings Corp

20 ETFs invest at least 1% in Sanwa Holdings Corp.

Frequently Asked Questions about Sanwa Holdings Corp

Within the last 12 months, Sanwa Holdings Corp paid a dividend of JP¥130. For the next 12 months, Sanwa Holdings Corp is expected to pay a dividend of JP¥146. This corresponds to a dividend yield of approximately 4.20%.
The dividend yield of Sanwa Holdings Corp is currently 4.20%.
Sanwa Holdings Corp pays biannually dividends. This is paid in the months of December, June.
The next dividend will be paid on 1 December 2026.
Sanwa Holdings Corp paid dividend every year within the last 10 years.
Dividends of JP¥146 are expected for the next 12 months. This corresponds to a dividend yield of 4.20%.
Sanwa Holdings Corp is assigned to the sector "Industrials".
Sanwa Holdings Corp operates in the industry "Building Products".
There are currently no known stock splits for Sanwa Holdings Corp.
In order to receive the future dividend from Sanwa Holdings Corp on 1 December 2026 you must have purchased your Sanwa Holdings Corp shares before the ex-date on 29 September 2026.
To receive the last dividend of Sanwa Holdings Corp on 25 June 2026 in the amount of JP¥68 you had to have the stock in your portfolio before the ex-day on 30 March 2026.
The last dividend was paid on 25 June 2026.
In 2025, dividends of JP¥121 were paid by Sanwa Holdings Corp.
Dividends from Sanwa Holdings Corp are paid in Japanese Yen.
The headquarters of Sanwa Holdings Corp is located in Japan.