| Ex-Date | Pay Date | Amount | Change |
|---|---|---|---|
| JP¥27.2 | 54.55% | ||
| JP¥15.6 | 34.48% | ||
| JP¥11.6 | 38.1% | ||
| JP¥17.6 | 17.33% | ||
| JP¥8.4 | -8.7% | ||
| JP¥9.2 | 43.75% | ||
| JP¥15 | 64.84% | ||
| JP¥9.1 | 160% | ||
| JP¥3.5 | -85.42% | ||
| JP¥24 | -2.04% | ||
| JP¥24.5 | 81.48% | ||
| JP¥13.5 | 8% | ||
| JP¥12.5 | 47.06% | ||
| JP¥8.5 | 21.43% | ||
| JP¥7 | -17.65% | ||
Business Engineering Corp pays a dividend yield (FWD) of 3.38%.
- ISIN
- WKN
- Symbol / Exchange
- / XTKS
- Value
- €6.65
- Dividend frequency
- biannually
- Security Type
- Equity
- Sector
Information Technology
- Country
Japan
- Dividend Currency
- Japanese Yen
- Earnings Date
ETFs holding Business Engineering Corp
1 ETFs invest at least 1% in Business Engineering Corp.
- Within the last 12 months, Business Engineering Corp paid a dividend of JP¥27. For the next 12 months, Business Engineering Corp is expected to pay a dividend of JP¥42. This corresponds to a dividend yield of approximately 3.38%.
- The dividend yield of Business Engineering Corp is currently 3.38%.
- Business Engineering Corp pays biannually dividends. This is paid in the months of June, December.
- The next dividend for Business Engineering Corp is expected in June.
- Business Engineering Corp paid dividend every year within the last 10 years.
- Dividends of JP¥42 are expected for the next 12 months. This corresponds to a dividend yield of 3.38%.
- Business Engineering Corp is assigned to the sector "Information Technology".
- The last stock split of Business Engineering Corp was on 29 December 2025 in the ratio 5:1.
- To receive the last dividend of Business Engineering Corp on 2 December 2025 in the amount of JP¥16 you had to have the stock in your portfolio before the ex-day on 29 September 2025.
- The last dividend was paid on 2 December 2025.
- In 2022, dividends of JP¥9 were paid by Business Engineering Corp.
- Dividends from Business Engineering Corp are paid in Japanese Yen.
- The headquarters of Business Engineering Corp is located in Japan.

