| Ex-Date | Pay Date | Amount | Change |
|---|---|---|---|
| CN¥0.046 | -34.29% | ||
| CN¥0.046 | -34.29% | ||
| CN¥0.07 | -75.27% | ||
| CN¥0.07 | -75.27% | ||
| CN¥0.283 | 72.25% | ||
| CN¥0.1643 | 181.82% | ||
| CN¥0.0583 | 45.75% | ||
| CN¥0.04 | -20% | ||
| CN¥0.05 | 66.67% | ||
| CN¥0.03 | -50% | ||
| CN¥0.06 | -40% | ||
| CN¥0.10 | 11.11% | ||
| CN¥0.09 | |||
China Wafer Level CSP Co Ltd Class A pays a dividend yield (FWD) of 0.16%.
- ISIN
- WKN
- Symbol / Exchange
- / XSHG
- Value
- €3.91
- Dividend frequency
- annually
- Security Type
- Equity
- Sector
Information Technology
- Country
China
- Dividend Currency
- Chinese Yuan
- Within the last 12 months, China Wafer Level CSP Co Ltd Class A paid a dividend of CN¥0.05. For the next 12 months, China Wafer Level CSP Co Ltd Class A is expected to pay a dividend of CN¥0.05. This corresponds to a dividend yield of approximately 0.16%.
- The dividend yield of China Wafer Level CSP Co Ltd Class A is currently 0.16%.
- China Wafer Level CSP Co Ltd Class A pays annually dividends. Payout is in May.
- The next dividend for China Wafer Level CSP Co Ltd Class A is expected in May.
- China Wafer Level CSP Co Ltd Class A paid dividend every year within the last 10 years.
- Dividends of CN¥0.05 are expected for the next 12 months. This corresponds to a dividend yield of 0.16%.
- China Wafer Level CSP Co Ltd Class A is assigned to the sector "Information Technology".
- The last stock split of China Wafer Level CSP Co Ltd Class A was on 20 May 2022 in the ratio 1:1.
- To receive the last dividend of China Wafer Level CSP Co Ltd Class A on 24 May 2024 in the amount of CN¥0.05 you had to have the stock in your portfolio before the ex-day on 24 May 2024.
- The last dividend was paid on 24 May 2024.
- In 2022, dividends of CN¥0.28 were paid by China Wafer Level CSP Co Ltd Class A.
- Dividends from China Wafer Level CSP Co Ltd Class A are paid in Chinese Yuan.
- The headquarters of China Wafer Level CSP Co Ltd Class A is located in China.