| Ex-Date | Pay Date | Amount | Change |
|---|---|---|---|
| HK$0.8751 | |||
| HK$0.44 | 1.13% | ||
| HK$0.4351 | |||
CNGR Advanced Materials Co Ltd- Class H pays a dividend yield (FWD) of 4.12%.
- ISIN
- WKN
- -
- Symbol / Exchange
- / XHKG
- Value
- €2.39
- Dividend frequency
- biannually
- Security Type
- Equity
- Sector
Materials
- Industry
Chemicals
- Country
China
- Dividend Currency
- Hong Kong Dollar
- Within the last 12 months, CNGR Advanced Materials Co Ltd- Class H paid a dividend of HK$0.44. For the next 12 months, CNGR Advanced Materials Co Ltd- Class H is expected to pay a dividend of HK$0.88. This corresponds to a dividend yield of approximately 4.12%.
- The dividend yield of CNGR Advanced Materials Co Ltd- Class H is currently 4.12%.
- CNGR Advanced Materials Co Ltd- Class H pays biannually dividends.
- The next dividend will be paid on 30 October 2026.
- Within the last 10 years, CNGR Advanced Materials Co Ltd- Class H has paid dividends in 1 of them.
- Dividends of HK$0.88 are expected for the next 12 months. This corresponds to a dividend yield of 4.12%.
- CNGR Advanced Materials Co Ltd- Class H is assigned to the sector "Materials".
- CNGR Advanced Materials Co Ltd- Class H operates in the industry "Chemicals".
- There are currently no known stock splits for CNGR Advanced Materials Co Ltd- Class H.
- In order to receive the future dividend from CNGR Advanced Materials Co Ltd- Class H on 30 October 2026 you must have purchased your CNGR Advanced Materials Co Ltd- Class H shares before the ex-date on 24 September 2026.
- To receive the last dividend of CNGR Advanced Materials Co Ltd- Class H on 22 July 2026 in the amount of HK$0.44 you had to have the stock in your portfolio before the ex-day on 9 June 2026.
- The last dividend was paid on 22 July 2026.
- In 2025, no dividends were paid by CNGR Advanced Materials Co Ltd- Class H.
- Dividends from CNGR Advanced Materials Co Ltd- Class H are paid in Hong Kong Dollar.
- The headquarters of CNGR Advanced Materials Co Ltd- Class H is located in China.

