Hewlett Packard Enterprise Co BRDR

Hewlett Packard Enterprise Co BRDRUnited States

€20.32
Dividend Yield (FWD)
1.68%
Annual Payout (FWD)
R$2.08
Dividend Growth Rate (CAGR)
#.##%
Ex-DatePay DateAmountChange
R$2.9536
82.44%
R$0.5193
2.75%
R$0.5054
-50.28%
R$1.0164
115.89%
R$0.4708
6.59%
R$0.4417
3.93%
R$1.6189
-35.54%
R$0.425
-26.67%
R$0.5796
-5.66%
R$0.6144
-1.65%
CSV Export

Hewlett Packard Enterprise Co BRDR pays a dividend yield (FWD) of 1.68%.

ISIN
WKN
-
Symbol / Exchange
/ BVMF
Value
€20.32
Dividend frequency
quarterly
Security Type
Equity
Sector

Information Technology

Country
United States

United States

Dividend Currency
Brazilian Real
Earnings Date
Resources

Frequently Asked Questions about Hewlett Packard Enterprise Co BRDR

Within the last 12 months, Hewlett Packard Enterprise Co BRDR paid a dividend of R$2.95. For the next 12 months, Hewlett Packard Enterprise Co BRDR is expected to pay a dividend of R$2.08. This corresponds to a dividend yield of approximately 1.68%.
The dividend yield of Hewlett Packard Enterprise Co BRDR is currently 1.68%.
Hewlett Packard Enterprise Co BRDR pays quarterly dividends. This is paid in the months of January, April, July, October.
Within the last 10 years, Hewlett Packard Enterprise Co BRDR has paid dividends in 5 of them.
Dividends of R$2.08 are expected for the next 12 months. This corresponds to a dividend yield of 1.68%.
Hewlett Packard Enterprise Co BRDR is assigned to the sector "Information Technology".
There are currently no known stock splits for Hewlett Packard Enterprise Co BRDR.
To receive the last dividend of Hewlett Packard Enterprise Co BRDR on 24 October 2024 in the amount of R$0.52 you had to have the stock in your portfolio before the ex-day on 18 September 2024.
The last dividend was paid on 24 October 2024.
In 2022, dividends of R$2.51 were paid by Hewlett Packard Enterprise Co BRDR.
Dividends from Hewlett Packard Enterprise Co BRDR are paid in Brazilian Real.
The headquarters of Hewlett Packard Enterprise Co BRDR is located in the United States.