- Current yield
- 5.86%
- Coupon p.a.
- 4.50%
- Yield to maturity
- 6.45%
| Ex-Date | Pay Date | Coupon |
|---|---|---|
| 4.50% | ||
| 2.25% | ||
| 2.25% | ||
| 4.50% | ||
| 2.25% | ||
| 2.25% | ||
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QUALCOMM Inc. 4,5% 22/52 has a current yield of 5.86%.
- ISIN
- WKN
- Exchange
- XFRA
- Value
- 76.79%
- Interest schedule
- biannually
- Security Type
- Bond
- Sector
-
- Country
United States
- Maturity
- Interest currency
- US Dollar
- Over the last 12 months QUALCOMM Inc. 4,5% 22/52 paid interest of 4.50% of nominal. For the coming 12 months 4.50% is expected, which is a current yield of about 5.86%.
- The current yield of QUALCOMM Inc. 4,5% 22/52 is 5.86%. It sets the coupon against today's price and is not the yield to maturity.
- At the current price the yield to maturity of QUALCOMM Inc. 4,5% 22/52 is 6.45% p.a. It assumes you hold the bond until 20 May 2052, that every coupon is paid as scheduled and that the nominal is repaid in full at the end.
- QUALCOMM Inc. 4,5% 22/52 pays interest twice a year. The interest dates fall in November, May.
- The next interest payment is due on 20 November 2026.
- QUALCOMM Inc. 4,5% 22/52 matures on 20 May 2052. That is the day the nominal is repaid.
- The last interest payment was made on 20 May 2026.
- In 2025 interest of 4.50% of nominal was paid.
- The interest of QUALCOMM Inc. 4,5% 22/52 is paid in US Dollar.
- The issuer of QUALCOMM Inc. 4,5% 22/52 is from the United States.